3-D integration and packaging is now well known to all in the semiconductor industry. Today the focus has shifted away from trying to understand the technology opportunity to one of understanding the practical challenges of technology adoption and commercialization, including who is getting there first, how, and at what cost. 3-D integration and packaging, of both devices as well as systems, represents an industry inflexion point, not just an evolutionary change thus there is a natural degree of uncertainty as companies scramble to secure market share, obtain new process and design tools, and of course, new customers and new applications.
This conference continues to give a broad, yet thorough perspective on the technomarket opportunity and challenge offered by building devices and systems in the vertical dimension. Industry leaders from around the world are invited to speak at this conference, on a wide range of topics important to the emerging and on-going 3-D integration and packaging efforts. The format of the conference and its presentations enables speakers to present the most up-to-date and forthright perspectives as possible. 3-D Architectures for Semiconductor Integration and Packaging
targets senior-level technologists, managers, and executives as speakers and attendees from leading companies and organizations around the world. The result is a unique forum where one can gain the latest insights to bring clarity in the direction of their own efforts. This year s conference sessions include the following:
- Meeting the 3-D Opportunity
- Toward the Frontline of Manufacturing
- 3-D Interposers Where, When, and Why?
- Critical Perspectives on 3-D IC Standards
- Facilitating Design of 3-D Interposers and Dle
- 3-D IC Advancements and the Systems Approach
- Handling, Bonding, and TSV Manufacturing Capabilities
- New Routes to Logic
