Bondexpo - International trade fair for bonding technology is a trade fair for industrial bonding technology. It includes bonding, encapsulation, sealing, foam and insulating materials and relevant equipment.
Bondexpo - International trade fair for bonding technology - Oct 2025, Messe Stuttgart (Trade Fair Centre Stuttgart Airport), Germany (26181)
Past Events
Bondexpo - International trade fair for bonding technology - 08-11 Oct 2024, Messe Stuttgart (Trade Fair Centre Stuttgart Airport), Germany (16726)
Bondexpo - International trade fair for bonding technology - 10-13 Oct 2023, Messe Stuttgart (Trade Fair Centre Stuttgart Airport), Germany (15398)
Bondexpo - International trade fair for bonding technology - 04-07 Oct 2022, Messe Stuttgart (Trade Fair Centre Stuttgart Airport), Germany (4673)
Important
Please, check "Bondexpo - International trade fair for bonding technology" official website for possible changes, before making any traveling arrangements
