The 34th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS 2025) is dedicated to electrical analysis, modeling, design and synthesis of electronic packages, interconnections and systems, including:
- innovative architectures and new design techniques
- Emerging and advanced issues
- Novel CAD methodologies, concepts, and algorithms for modeling, simulation and optimization
with a focus on:
- High-speed channels, links, backplanes, serial and parallel interconnects, SerDes
- System-level, board-level and on-chip interconnects
- Multiconductor transmission lines
- Low power mobile and personal applications
- Jitter and noise management
- Memory and DDR interfaces
- Power integrity and power distribution networks (PDNs)
- Signal and thermal integrity
- D interconnects, 3D packages, TSVs and MCMs
- Electronic packages and microsystems
- RF/microwave packaging structures, RFICs, mixed signal modules and wireless switches
- Nano interconnects and nano structures
- Electromagnetic (EM) and EM interference modeling, simulation algorithms, tools and flows
- Package-chip co-design
- Advanced and parallel CAD techniques for signal, power and thermal integrity analysis
- Macromodeling and model order reduction as it applies to electrical analysis
- Measurement and data analysis techniques for system-level and on-chip structures
