IC Packaging Fair 2025 focuses on fostering innovation and business connections in the advanced packaging industry by integrating IC design, packaging, and testing with manufacturing services.
Product & Service Categories
Automatic test equipment ATE
Wafer thinning machines
Microwave/plasma cleaning machines
Plating equipment
Metal wires
Probe stations
Adhesive films
Film stripping machines
Injection molding machines
Annealing furnaces
AOI testing equipment
Lead frames
Thickness/roughness measuring machines
Wafer mounting machines
Scribing solutions
Epoxy resins
Who should Attend
OEM/EMS manufacturers
Automotive electronics professionals
IC design companies
Semiconductor packaging and testing factories
Electronic product design solution providers
Military electronics specialists
Medical electronics professionals
5G and IoT technology developers
Electronic brand OBMs
Wireless communication experts
Display chip and module manufacturers
Venue
Shenzhen World Exhibition & Convention Center ,
No. 1 Zhancheng Road, Fuhai Street, Bao`an District, Shenzhen, China
We use cookies to enhance your browsing experience, serve personalized ads or content, and analyze our traffic.By clicking "Accept", you consent to our use of cookies. You can manage your preferences or learn more by clicking "Customize" or visiting our Cookies Policy page.
