ICP 2014 - Packaging Technologies for IC Devices is an Exhibition Featuring Various Products and Technologies for Semiconductors, Sensor Modules and LED Packaging.
Topics
- Surface Treatment & Finishing Technologies for Semiconductors, PCBs, Electronic Devices
- Various IC Packages
- Substrate, Materials for Substrate, Various Software
- Substrate Zone
- Analysis / Simulation Software for IC Packaging
- Semiconductor Device Inspection & Testing Zone
- Gathering World`s TOP companies specialised in IC design, assembly and testing services!
- Packaging Materials / Components
- SATS / Contract Design Services Zone
- Plating Materials / Chemicals / Equipment
- Assembly Equipment
- Plating / Etching Zone
Who should Attend
Sensor Manufacturers, Automotive Electronics Manufacturers, Set Manufacturers (in high-density SMT), Assembly Manufacturers/SATS, MEMS Devices/LED Manufacturers and Semiconductor Manufacturers.
