IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2025)

  • Dec 2025

Description

Topics
  • Testing on 3DIC and SiP
  • DIC / 3D-Stacked IC
  • Power Integrity / Ground Noise
  • Substrate Technology
  • SiP/SoP
  • Time/Frequency Domain Measurement Techniques
  • Electromagnetic Compatibility (EMC)
  • Embedded Device Substrate
  • Package Reliability
  • Design and Modeling for High-speed Channels and Interconnects
  • Advanced Simulation Tools and CAD
  • RF/mmW Circuit Package
  • Signal Integrity
Who should Attend

World class designers and researchers.

More Details

Prices:
200-495 US Dollar (Estimated)
Exhibition:
Included
Organizer:
IEEE
Website:

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Important

Please, check "IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)" official website for possible changes, before making any traveling arrangements

Event Categories

Industry: Electronics & Electrical
Science: Engineering

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