37th IEEE International Symposium on Power Semiconductor Devices & ICs (ISPSD 2025)

The 37th IEEE International Symposium on Power Semiconductor Devices & ICs (ISPSD 2025) is dedicated to integrated power and ICs, power devices and power packaging.

Topics

• Processes
  Doping Technology, Process Integration, Passivation, Lifetime Control and Crystal Growth
• Devices
  Device Design, Device Physics, High Power Devices, High Frequency Devices, RF Power Devices, Smart Power Devices, Reliability, Safe-Operating Area and ESD
• Materials
  GaAs, Si, GaN, SiC and Diamond
• Modeling/Simulation: Circuit Simulation, Device, Verification Tools and Layout
• Packaging
  Power SiP, Novel Packaging Concepts, Thermal Analysis, Stress and Thermal Management
• Power ICs
  SOI, Isolation Techniques, Device Technology, Circuit Design, SOA, Energy Capability, ESD, Reliability, Monolithic vs Hybrid and Power SoC
• Applications
  Computer, Hybrid Vehicles, Motor Drives, Telecom Power and Utility