International Conference on Integrated Power Electronics Systems (CIPS 2026)

Topics

• General aspects of packaging
  • Assembly concepts, embedded power, 3D integration
  • System and component packaging
  • Additive manufacturing
  • New materials incl. interface materials and interconnects
  • Design for high temperature applications
  • High voltage insulation
  • Multidomain CAD and design tools
  • Cooling concepts
• Components to be integrated
  • Wide bandgap devices and monolithic integration
  • Advanced silicon devices and monolithic integration
  • Passive components
  • Gate drivers
  • Sensors and actuators
• System and application aspects
  • Integration of power electronics into electric machines
  • Mechatronic systems and their applications
  • Integration with sensors and actuators
  • Challenges of fast switching on circuit/system level winding insulation, bearin currents, earth leakage, touch current..
  • Overall system optimisation
• Power packages and modules
  • Discrete semiconductor packages
  • Bare chip packaging
  • Power semiconductor modules
  • Hermetic semiconductor packages
  • Heterogeneous integration, power system­in­package
• Clean switching, electromagnetic compatibility (EMC)
  • Oscillation free design
  • Parasitics optimization: electromagnetically optimized design
  • Design of drivers for improved switching waveforms
  • Symmetric paralleling of power semiconductors
  • EMI filter integrations: material, component design, implementation
  • EMC interferences reductions: optimized control, active filter and passive filter design
  • Integrated sensors and high bandwidth measurement
• Reliability and availability
  • Robustness validation, physics of failure, failure analysis
  • Reliability requirements, mission profiles
  • Intelligent reliability testing
  • Modelling and simulation of lifetime
  • Fault tolerant designs and applications
  • Prognostics and health management

Who should Attend

Engineers coming from academia and industry involved in Component development, System development, Research and Reliability engineering.