InterPACK & ICNMM 2015 - The International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems and The International Conference on Nanochannels, Microchannels and Minichannels

Topics

• Emerging Technology Frontiers
• Advanced Electronics and Photonics: Packaging, Interconnect and Reliability
• Thermal Management
• MEMS and NEMS
• Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales
• Thermal Management Using Micro Channels, Jets, Sprays
• Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices
• Advanced Fabrication and Manufacturing
• Technology Update Talks
• Panels
• Student Poster and Networking Session
• Mini Workshops and Tutorials
• Advanced Electronics and Photonics, Packaging Materials and Processing
• Exhibits, Vendors, and Sponsors (Technical Presentation)

Who should Attend

Researchers and practitioners from academia, industry, and government.